Samsung reportedly wins IBM’s 7nm chip contract

Samsung has won a chip manufacturing contract for IBM’s next-gen data center chip, and it will be produced with improved 7nm processing technology.

According to the source from Korea, the company will process IBM’s server CPU semiconductor named Power11. The production will include 2.5D ISC architecture packaging to improve the performance of the end product.

Specifically, the chip manufacturing will use the 7LPP process, allowing more precise application and finer circuit patterns. Compared to previous processing tech, the new version has reportedly brought a 23% performance jump and a 45% increase in power intake efficiency.

On the other hand, the 2.5D ISC architecture packaging is an advanced technology used to produce high-performance semiconductors, which employs multiple chips (dies) in proximity within a single package to increase the data transfer speed.

IBM is one of the top five data center CPU service providers, despite lagging behind the likes of Intel, AMD, and Nvidia, the company still has a niche share in the market among corporations in different segments. Its Power11 brings 99.9999% data center uptime, equipped with power efficiency without downtime.

Samsung is also making its way to advanced nodes such as 2nm, but it still serves a large customer base for the 7nm node due to yields and performance. For now, there’s no information on when Samsung will start IBM’s 7nm server chip production and delivery.

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